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Projects / Programmes source: ARIS

Plasma technologies for composite commutators processing

Research activity

Code Science Field Subfield
2.09.05  Engineering sciences and technologies  Electronic components and technologies  Vacuum technologies 

Code Science Field
T155  Technological sciences  Coatings and surface treatment 
Keywords
plasma processing, surface activation, selective plasma etching, discharge cleaning, plasma characterization, composites, metals, commutator
Evaluation (rules)
source: COBISS
Researchers (12)
no. Code Name and surname Research area Role Period No. of publicationsNo. of publications
1.  22289  PhD Uroš Cvelbar  Electronic components and technologies  Researcher  2003 - 2004  730 
2.  21018  Marjan Drmota  Mechanical design  Researcher  2002 - 2004 
3.  18635  Tatjana Filipič    Researcher  2002 - 2004  24 
4.  15703  PhD Janez Kovač  Electronic components and technologies  Researcher  2002 - 2004  680 
5.  21019  Ludvik Kumar  Manufacturing technologies and systems  Researcher  2002 - 2004  22 
6.  10429  PhD Miran Mozetič  Electronic components and technologies  Head  2002 - 2004  1,356 
7.  09105  Borut Praček  Electronic components and technologies  Researcher  2002 - 2004  113 
8.  17622  Janez Trtnik    Researcher  2002 - 2004  18 
9.  20048  PhD Alenka Vesel  Electronic components and technologies  Researcher  2002 - 2003  695 
10.  01741  PhD Anton Zalar  Electronic components and technologies  Researcher  2003 - 2004  383 
11.  03366  Marko Žumer  Electronic components and technologies  Researcher  2002 - 2003  110 
12.  05758  PhD Lea Županc Mežnar  Chemistry  Researcher  2002 - 2004  38 
Organisations (3)
no. Code Research organisation City Registration number No. of publicationsNo. of publications
1.  0106  Jožef Stefan Institute  Ljubljana  5051606000  91,408 
2.  1682  KOLEKTOR MOBILITY Upravljanje naložb d.o.o. (Slovene)  Idrija  5034558  250 
3.  2162  KOLEKTOR SIKOM Komutacijski in rotajski sistemi d.o.o. (Slovene)  Idrija  1872303 
Abstract
In order to optimize the technologies for plasma activation, selective plasma etching and discharge cleanning for the needs of our industrial partner the influence of plasma parameters on processing of components for commutators will be studied. For each technology, the optimal plasma parameters in the view of required quality and duration of processing will be determined. For plasma processing we will use our experimental plasma reactors where reactive oxygen and hydrogen plasmas with different parameters will be generated. Plasma parameters will be measured with Langmuir and catalytic probes, while the surfaces of components will be characterized by AES depth profilling, electron microscopy and methods for measuring surface energy and adhesion of metallization layers.
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