Projects / Programmes
Plasma technologies for composite commutators processing
Code |
Science |
Field |
Subfield |
2.09.05 |
Engineering sciences and technologies |
Electronic components and technologies |
Vacuum technologies |
Code |
Science |
Field |
T155 |
Technological sciences |
Coatings and surface treatment |
plasma processing, surface activation, selective plasma etching, discharge cleaning, plasma characterization, composites, metals, commutator
Researchers (12)
no. |
Code |
Name and surname |
Research area |
Role |
Period |
No. of publicationsNo. of publications |
1. |
22289 |
PhD Uroš Cvelbar |
Electronic components and technologies |
Researcher |
2003 - 2004 |
730 |
2. |
21018 |
Marjan Drmota |
Mechanical design |
Researcher |
2002 - 2004 |
6 |
3. |
18635 |
Tatjana Filipič |
|
Researcher |
2002 - 2004 |
24 |
4. |
15703 |
PhD Janez Kovač |
Electronic components and technologies |
Researcher |
2002 - 2004 |
670 |
5. |
21019 |
Ludvik Kumar |
Manufacturing technologies and systems |
Researcher |
2002 - 2004 |
22 |
6. |
10429 |
PhD Miran Mozetič |
Electronic components and technologies |
Head |
2002 - 2004 |
1,352 |
7. |
09105 |
Borut Praček |
Electronic components and technologies |
Researcher |
2002 - 2004 |
113 |
8. |
17622 |
Janez Trtnik |
|
Researcher |
2002 - 2004 |
18 |
9. |
20048 |
PhD Alenka Vesel |
Electronic components and technologies |
Researcher |
2002 - 2003 |
689 |
10. |
01741 |
PhD Anton Zalar |
Electronic components and technologies |
Researcher |
2003 - 2004 |
383 |
11. |
03366 |
Marko Žumer |
Electronic components and technologies |
Researcher |
2002 - 2003 |
110 |
12. |
05758 |
PhD Lea Županc Mežnar |
Chemistry |
Researcher |
2002 - 2004 |
38 |
Organisations (3)
Abstract
In order to optimize the technologies for plasma activation, selective plasma etching and discharge cleanning for the needs of our industrial partner the influence of plasma parameters on processing of components for commutators will be studied. For each technology, the optimal plasma parameters in the view of required quality and duration of processing will be determined. For plasma processing we will use our experimental plasma reactors where reactive oxygen and hydrogen plasmas with different parameters will be generated. Plasma parameters will be measured with Langmuir and catalytic probes, while the surfaces of components will be characterized by AES depth profilling, electron microscopy and methods for measuring surface energy and adhesion of metallization layers.