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Projects / Programmes source: ARIS

Materials and processes for shaping miniature thick film ceramic 2D and 3D structures

Research activity

Code Science Field Subfield
2.09.01  Engineering sciences and technologies  Electronic components and technologies  Materials for electronic components 

Code Science Field
T171  Technological sciences  Microelectronics 
Keywords
thick film technology, thick film materials, piezoelectrics, resistors, sensors, actuators, interactions, electrical characteristics
Evaluation (rules)
source: COBISS
Researchers (9)
no. Code Name and surname Research area Role Period No. of publicationsNo. of publications
1.  08346  Darko Belavič  Electronic components and technologies  Researcher  2007 - 2009  682 
2.  06896  Silvo Drnovšek    Technical associate  2007 - 2009  305 
3.  06423  PhD Janez Holc  Materials science and technology  Researcher  2007 - 2009  862 
4.  03219  PhD Marko Hrovat  Materials science and technology  Head  2007 - 2009  712 
5.  19391  Mitja Jerlah    Technical associate  2007 - 2009  115 
6.  02627  PhD Marija Kosec  Electronic components and technologies  Researcher  2007 - 2009  1,494 
7.  27820  Tina Ručigaj Korošec    Technical associate  2007 - 2009 
8.  04378  PhD Marina Santo Zarnik  Electronic components and technologies  Researcher  2007 - 2009  374 
9.  26468  PhD Hana Uršič Nemevšek  Electronic components and technologies  Junior researcher  2007 - 2009  650 
Organisations (2)
no. Code Research organisation City Registration number No. of publicationsNo. of publications
1.  0106  Jožef Stefan Institute  Ljubljana  5051606000  90,753 
2.  1704  HIPOT-R&D Research and development in Technologies and Systems  Otočec  5981344  759 
Abstract
Thick film technology enables the printing of 1 m to 100 m thick films on different substrates which wil be used for different applications e.g. sensors, actuators and transducers. Sensing layers will be made from resistive or piezoelectric thick films. Substrates will be either inert (e.g. alumina) or reactive ceramics (e.g. glass bonded low temperature fired ceramics – LTCC). 2D and 3D structures will be realised either by screen printing, 3D printing by ink jet printer and by lamination of green ceramic foils. These structures will be prepared with complex features such as membranes, channels and cavities. 3D structrures with burried features will be realised by the us of sacrificied layers which oxidise during firing process. The characteristics of sacrificied material and possible interaction with active films will be studied. For sensing films thick film resistors, and lead based and lead free piezoelectric will be investigated. Interactions, mainly due to the interdiffusion of metal oxides between substrates and active films and its influence functional characteristic of films wil be studied.
Significance for science
The research on processing of complex ceramic materials with 2D and 3D structures is one of the important topics in the filed of electronic components The proposed project enable us to maintain the distinct position in this research field, i.e., of 2 D and 3 D thick film sensors and actuators structures, and to continue to collaborate in international projects. The work on the project will help our laboratory to improve the knowledge on processing and shaping of ceramics and keep the laboratory in world-leading position in the field of ceramic processing and thick film sensors. The partners from the industry find in these achievements the possibility for the economical benefits. Most of obtained results are novel and therefore an original contribution to a science as there is very little data on these topics in open literature
Significance for the country
Electronic Ceramics Department of the Jozef Stefan Institute and the research organization HIPOT RR d.o.o. has the equipment and knowledge in the field of ceramic materials, materials for electronics, and the design and manufacture of ceramic micro-electro-mechanical systems. The obtained results are a source of knowledge for applicative and development projects, and are very useful to manufacturers and users of electronic components and thick film hybrid circuits. The work on the project contributes to a new knowledge for researchers of both research organisations and enables increased competitiveness and the expansion of existing market. Therefore both project partners are compatible partner in many national and international projects. The construction and the technology knowledge on 3D LT structure enable the successful work in few applicative projects on following products Ceramic pressure sensors for low-pressure ranges, Capacitive ceramic pressure sensors, and different type of ceramic micro-reactors.. The results of the project contribute to a new knowledge for researchers of both research organisations and through different industrial project increased competitiveness of industrial partner(s). The results of the project also contributed to success application of Centre of Excellence with the title “Advanced Materials and Technologies for the Future” (NAMST), and Eureka project E!4570 »New generation of 3D Integrated Passive Components and Microsystems in LTCC Technology« (IPCTECH). In the frame of the research project the Slovenian – Poland cooperation in science and technology project with the title Novel Possibilities of Creation Three-Dimensional Structures in Low-Temperature Co-Fired Ceramics (LTCC) was performed.
Most important scientific results Annual report 2008, final report, complete report on dLib.si
Most important socioeconomically and culturally relevant results Annual report 2008, final report, complete report on dLib.si
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